Browsing by author "Reese, E."
Now showing items 1-3 of 3
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Electro-conductive adhesives for high density package and flip-chip interconnections
Wojciechowski, Dominique; Vanfleteren, Jan; Reese, E.; Hagedorn, H. W. (2000) -
Fine pitch interconnection using anisotropic conducting adhesives
Reese, E.; Vanfleteren, Jan (1997) -
New adhesives for high density flip-chip interconnections
Wojciechowski, Dominique; Vanfleteren, Jan; Reese, E.; Hagedorn, H. (1998)