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Conference contributions
New adhesives for high density flip-chip interconnections
Publication:
New adhesives for high density flip-chip interconnections
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Date
1998
Proceedings Paper
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wojciechowski, Dominique
;
Vanfleteren, Jan
;
Reese, E.
;
Hagedorn, H.
Journal
Abstract
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1938
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Acq. date: 2025-12-12
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Views
1938
since deposited on 2021-10-01
3
last month
1
last week
Acq. date: 2025-12-12
Citations