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New adhesives for high density flip-chip interconnections
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Authors
Wojciechowski, Dominique
;
Vanfleteren, Jan
;
Reese, E.
;
Hagedorn, H.
Conference
Proceedings IMAPS International Symposium on Microelectronics
Title
New adhesives for high density flip-chip interconnections
Publication type
Proceedings paper
Embargo date
9999-12-31
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