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Electro-conductive adhesives for high density package and flip-chip interconnections
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Authors
Wojciechowski, Dominique
;
Vanfleteren, Jan
;
Reese, E.
;
Hagedorn, H. W.
Issue
7
Journal
Microelectronics Reliability
Volume
40
Title
Electro-conductive adhesives for high density package and flip-chip interconnections
Publication type
Journal article
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