Publication:
Electro-conductive adhesives for high density package and flip-chip interconnections
Date
| dc.contributor.author | Wojciechowski, Dominique | |
| dc.contributor.author | Vanfleteren, Jan | |
| dc.contributor.author | Reese, E. | |
| dc.contributor.author | Hagedorn, H. W. | |
| dc.contributor.imecauthor | Vanfleteren, Jan | |
| dc.contributor.orcidimec | Vanfleteren, Jan::0000-0002-9654-7304 | |
| dc.date.accessioned | 2021-10-14T14:20:17Z | |
| dc.date.available | 2021-10-14T14:20:17Z | |
| dc.date.issued | 2000 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/4947 | |
| dc.source.beginpage | 1215 | |
| dc.source.endpage | 1226 | |
| dc.source.issue | 7 | |
| dc.source.journal | Microelectronics Reliability | |
| dc.source.volume | 40 | |
| dc.title | Electro-conductive adhesives for high density package and flip-chip interconnections | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |