Browsing by author "De Raedt, Walter"

0-Level packaging techniques for flip-chip mounted MMICs

De Raedt, Walter; Brebels, Steven; Monfraix, P.; Carchon, Geert; Jourdain, Anne; Tilmans, Harrie (2001)

'1 Thru +2.5 Reflects': A new technique for de-embedding MIC/MMIC device measurements in fixed-length fixtures

Wang, Connie; Nauwelaers, Bart; De Raedt, Walter; Van Rossum, Marc (1996)

24GHz LNA in 90nm RF-CMOS with high-Q above-IC inductors

Dupuis, Olivier; Sun, Xiao; Carchon, Geert; Soussan, Philippe; Ferndahl, Mattias; Decoutere, Stefaan; De Raedt, Walter (2005-09)

3-D antenna-in-packaging solution for microwave wireless sensor networks nodes

Enayati, Amin; Brebels, Steven; De Raedt, Walter; Vandenbosch, Guy (2011)

3D chip stacking of RF devices with Cu TSV, Cu/Sn bumps and sealing ring

Zhang, Wenqi; Majeed, Bivragh; Sun, Xiao; Posada Quijano, Guillermo; Diekmann, C.; Eggs, C.; Schmidhammer, E.; De Raedt, Walter (2011)

3D heterogeneous integration techniques for wireless devices

De Raedt, Walter; Brebels, Steven; Soussan, Philippe; Beyne, Eric (2010)

3D integration technology: status and application development

Ramm, P.; Klumpp, A.; Weber, Josef; Lietaer, N.; Taklo, Maaike; De Raedt, Walter; Fritzsch, T.; Couderc, Pascal (2010)

3D Si-level integration in wireless sensor node

van Engen, Piet; van Doremalen, Ric; Jochems, Wouter; Rommers, Ad; Cheng, Shi; Rydberg, Anders; Fritzsch, Thomas; Wolf, Jürgen; De Raedt, Walter; Muller, Philippe; Alarcon, Eduardo; Sanduleanu, Mihai (2009)

3D SoP integration of a BAN sensor node

Brebels, Steven; Sanders, Steven; Winters, Christophe; Webers, Tomas; Vaesen, Kristof; Carchon, Geert; Gyselinckx, Bert; De Raedt, Walter (2005-06)

3D stack packaging solution for FBAR devices_3D packaging demonstrator and RF performance

Sun, Xiao; Posada Quijano, Guillermo; Majeed, Bivragh; Zhang, Wenqi; De Raedt, Walter; Diekmann, C.; Eggs, C.; Schmidhammer, E. (2011)

3D stacking heterogeneous integration for devices and modules

Sun, Xiao; De Raedt, Walter; Beyne, Eric (2012)

3D system integration for miniaturised modules

Parton, Els; De Raedt, Walter (2004-02)

3D system-in-package integration of 60 GHz aperture-coupled micromachined microstrip antennas

Brebels, Steven; Mohammadpour-Aghdam, Karim; De Raedt, Walter; Vandenbosch, Guy (2010)

3D TSV based high frequency components for RF IC and RF MEMS applications

Fernandez-Bolanos, Montserrat; Vitale, Wolfgang; Maqueda Lopez, Mariazel; Ionescu, Adrian M.; Ocket, Ilja; De Raedt, Walter; Klumpp, Armin; Merkel, R.; Weber, J.; Ramm, P.; Enayati, Amin (2016)

3D-Systemintegration. Der neue Weg zu stark miniaturisierten Systemen

Parton, Els; De Raedt, Walter (2004)

3D-Systemintegration: Der Neue Weg zu Hochminiaturisierten Systemen

Parton, Els; De Raedt, Walter (2004)

45 degrees loaded-line phase shifter using switchable slow wave transmission lines

Brebels, Steven; Rottenberg, Xavier; Ekkels, Phillip; Mertens, Robert; De Raedt, Walter (2007)

45nm planar bulk CMOS 23GHz LNA with above IC inductors

Wen-Chieh, Wang; Zue-Der, Huang; Carchon, Nadine; Mercha, Abdelkarim; Decoutere, Stefaan; De Raedt, Walter; Chung-Yu, Wu (2010)

50-to-67GHz ESD-protected power amplifiers in digital 45nm LP CMOS

Raczkowski, Kuba; Thijs, Steven; De Raedt, Walter; Nauwelaers, Bart; Wambacq, Piet (2009-02)

57-64 GHz seven-pole bandpass filter substrate integrated waveguide (SIW) in LTCC

Dancila, Dragos; Rottenberg, Xavier; Tilmans, Harrie; De Raedt, Walter; Huynen, Isabelle (2011)