Browsing by author "Bai, Dongshun"

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Advances in thin wafer debonding and ultra thin 28nm FinFET substrate transfer

Phommahaxay, Alain; Guerrero, Alice; Jourdain, Anne; Potoms, Goedele; Verbinnen, Greet; Bai, Dongshun; Yess, Kim; Arnold, Kim; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric (2017)
Single-release-layer process for temporary bonding applications in 3D integration area

Jourdain, Anne; Phommahaxay, Alain; Velenis, Dimitrios; Guerrero, Alice; Bai, Dongshun; Yess, Kim; Arnold, Kim; Miller, Andy; Rebibis, Kenneth June; Beyer, Gerald; Beyne, Eric (2015)