Single-release-layer process for temporary bonding applications in 3D integration area

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Authors
Jourdain, Anne; Phommahaxay, Alain; Velenis, Dimitrios; Guerrero, Alice; Bai, Dongshun; Yess, Kim; Arnold, Kim; Miller, Andy; Rebibis, Kenneth June; Beyer, Gerald; Beyne, Eric
Conference
IEEE 65th Electronic Components & Technology Conference - ECTC
Title
Single-release-layer process for temporary bonding applications in 3D integration area
Publication type
Proceedings paper
Embargo date
9999-12-31
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