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Conference contributions
Single-release-layer process for temporary bonding applications in 3D integration area
Publication:
Single-release-layer process for temporary bonding applications in 3D integration area
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Date
2015
Proceedings Paper
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30506.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Jourdain, Anne
;
Phommahaxay, Alain
;
Velenis, Dimitrios
;
Guerrero, Alice
;
Bai, Dongshun
;
Yess, Kim
;
Arnold, Kim
;
Miller, Andy
;
Rebibis, Kenneth June
;
Beyer, Gerald
;
Beyne, Eric
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Views
1880
since deposited on 2021-10-22
2
last month
1
last week
Acq. date: 2026-02-24
Citations