Publication:

Single-release-layer process for temporary bonding applications in 3D integration area

Date

2015
Proceedings Paper
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dc.contributor.authorJourdain, Anne
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorGuerrero, Alice
dc.contributor.authorBai, Dongshun
dc.contributor.authorYess, Kim
dc.contributor.authorArnold, Kim
dc.contributor.authorMiller, Andy
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorGuerrero, Alice
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T19:59:04Z
dc.date.available2021-10-22T19:59:04Z
dc.date.embargo9999-12-31
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25443
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7159699
dc.source.beginpage896
dc.source.conferenceIEEE 65th Electronic Components & Technology Conference - ECTC
dc.source.conferencedate26/05/2015
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage898
dc.title

Single-release-layer process for temporary bonding applications in 3D integration area

dc.typeProceedings paper
dspace.entity.typePublication
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