Browsing by author "Hu, Kehui"
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Photocurable resin-silica composites with low thermal expansion for 3D printing microfluidic components onto printed circuit boards
Fei, Guanghai; Nie, Lei; Zhong, Lipeng; Shi, Qimin; Hu, Kehui; Parra-Cabrera, Cesar; Oprins, Herman; Ameloot, Rob; Yang, Shoufeng (2022-06)