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Photocurable resin-silica composites with low thermal expansion for 3D printing microfluidic components onto printed circuit boards
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Authors
Fei, Guanghai
;
Nie, Lei
;
Zhong, Lipeng
;
Shi, Qimin
;
Hu, Kehui
;
Parra-Cabrera, Cesar
;
Oprins, Herman
;
Ameloot, Rob
;
Yang, Shoufeng
DOI
10.1016/j.mtcomm.2022.103482
ISSN
2352-4928
Issue
na
Journal
MATERIALS TODAY COMMUNICATIONS
Volume
31
Title
Photocurable resin-silica composites with low thermal expansion for 3D printing microfluidic components onto printed circuit boards
Publication type
Journal article
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Version
Item
Date
Summary
3
20.500.12860/39862.3
*
2022-06-01T08:09:20Z
validation by library/open access desk
2
20.500.12860/39862.2
2022-05-23T06:17:26Z
validation by imec author
1
20.500.12860/39862
2022-05-21T02:19:27Z
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