Browsing by author "Herms, Martin"
Now showing items 1-6 of 6
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A photo-elastic microscopy study of the temperature dependecy of stress induced by through silicon vias in silicon
Herms, Martin; Wagner, Matthias; De Messemaeker, Joke; De Wolf, Ingrid (2017) -
Copper through silicon vias studied by the photo-elastic Scanning Infrared Microscope SIREX
Herms, Martin; Wagner, M.; De Wolf, Ingrid (2016) -
Defect-induced stress imaging in single and multi-crystalline semiconductor materials
Herms, Martin; Wagner, Matthias; Kayser, Stefan; Kießling, Frank; Poklad, Anna; Zhao, Ming; Kretzer, Ulrich (2018) -
Failure and stress analysis of Cu TSVs using
De Wolf, Ingrid; Khaled, Ahmad; Herms, Martin; Wagner, Matthias; Djuric, Tatjana; Czurratis, Peter; Brand, Sebastian (2015) -
Materials characterization and device analysis for evaluation of semiconductor processes by highly-sophisticated photoelastic stress measurement technique
Herms, Martin; Wagner, Matthias; Molchanov, Alexander; Lin, Pinyen; De Wolf, Ingrid; Zhao, Ming (2015) -
Photo-elastic characterization of defect structures in mono and multi-crystalline semiconductor materials
Herms, Martin; Wagner, Matthias; Kayser, Stefan; Kießling, Frank; Poklad, Anna; Zhao, Ming; Kretzer, Ulrich (2016-09)