Browsing by author "Ma, Paul"

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CVD-Mn(Nx) as copper diffusion barrier for advanced interconnect technologies

Jourdan, Nicolas; Machillot, Jerome; Barbarin, Yohan; Siew, Yong Kong; Ai, Hua; Cockburn, Andrew; Nguyen, Mai Phuong; Van Elshocht, Sven; Boemmels, Juergen; Lakshmanan, A.; Ma, Paul; Narasimhan, Murali; Tokei, Zsolt (2013)
Metallization of sub- 30 nm Interconnects: Comparison of different liner/seed combinations

Carbonell, Laure; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Caluwaerts, Rudy; Devriendt, Katia; Altamirano Sanchez, Efrain; Wouters, Johan M. D.; Gravey, Virginie; Shah, Kavita; Luo, Qian; Sundarrajan, Arvind; Lu, Jiang; Aubuchon, Joseph; Ma, Paul; Narasimhan, Murali; Cockburn, Andrew; Tokei, Zsolt; Beyer, Gerald (2009)