Publication:

CVD-Mn(Nx) as copper diffusion barrier for advanced interconnect technologies

Date

2013

Meeting abstract

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Files

27157.pdf 788.58 KB

Author(s)

Jourdan, Nicolas

;

Machillot, Jerome

;

Barbarin, Yohan

;

Siew, Yong Kong

;

;

Cockburn, Andrew

;

Nguyen, Mai Phuong

;

Van Elshocht, Sven

;

Boemmels, Juergen

;

;

;

Narasimhan, Murali

;

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Acq. date: 2026-02-25