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Conference contributions
CVD-Mn(Nx) as copper diffusion barrier for advanced interconnect technologies
Publication:
CVD-Mn(Nx) as copper diffusion barrier for advanced interconnect technologies
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Date
2013
Meeting abstract
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27157.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Jourdan, Nicolas
;
Machillot, Jerome
;
Barbarin, Yohan
;
Siew, Yong Kong
;
Ai, Hua
;
Cockburn, Andrew
;
Nguyen, Mai Phuong
;
Van Elshocht, Sven
;
Boemmels, Juergen
;
Lakshmanan, A.
;
Ma, Paul
;
Narasimhan, Murali
;
Tokei, Zsolt
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1980
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Acq. date: 2025-12-10
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1980
since deposited on 2021-10-21
1
last month
1
last week
Acq. date: 2025-12-10
Citations