Browsing by author "Muga, Karthik"
Now showing items 1-2 of 2
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A highly reliable 1.4μm pitch via-last TSV module for wafer-to-wafer hybrid bonded 3D-SOC systems
Van Huylenbroeck, Stefaan; De Vos, Joeri; El-Mekki, Zaid; Jamieson, Geraldine; Tutunjyan, Nina; Muga, Karthik; Stucchi, Michele; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
A novel integration scheme for wafer singulation and selective processing using temporary dry film resist
La Grappe, Alexandre; Visker, Evert; Redolfi, Augusto; Peng, Lan; Muga, Karthik; Huls, David; Vanhaelemeersch, Serge; Lauwers, Anne; Ackaert, Jan (2021)