Browsing by author "Puligadda, Rama"

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Process characterization of thin wafer debonding with thermoplastic materials

Phommahaxay, Alain; Jourdain, Anne; Verbinnen, Greet; Woitke, Tobias; Stieber, Ralf; Bisson, Peter; Gabriel, Markus; Spiess, Walter; Guerrero, Alice; McCutcheon, Jeremy; Puligadda, Rama; Bex, Pieter; Van den Eede, Axel; Swinnen, Bart; Beyer, Gerald; Miller, Andy; Beyne, Eric (2012)
Ultrathin wafer handling in 3D stacked IC manufacturing combining a novel zoneBOND™ temporary bonding process with room temperature peel debonding

Phommahaxay, Alain; Jourdain, Anne; Verbinnen, Greet; Woitke, Tobias; Bisson, Peter; Gabriel, Markus; Spiess, Walter; Guerrero, Alice; McCutcheon, Jeremy; Puligadda, Rama; Bex, Pieter; Van den Eede, Axel; Swinnen, Bart; Beyer, Gerald; Miller, Andy; Beyne, Eric (2012)