Authors

Phommahaxay, Alain; Jourdain, Anne; Verbinnen, Greet; Woitke, Tobias; Bisson, Peter; Gabriel, Markus; Spiess, Walter; Guerrero, Alice; McCutcheon, Jeremy; Puligadda, Rama; Bex, Pieter; Van den Eede, Axel; Swinnen, Bart; Beyer, Gerald; Miller, Andy; Beyne, Eric

Conference

IEEE International 3D Systems Integration Conference - 3DIC

Title

Ultrathin wafer handling in 3D stacked IC manufacturing combining a novel zoneBOND™ temporary bonding process with room temperature peel debonding

Publication type

Proceedings paper