Publication:
Ultrathin wafer handling in 3D stacked IC manufacturing combining a novel zoneBOND™ temporary bonding process with room temperature peel debonding
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1990 since deposited on 2021-10-20
Acq. date: 2026-02-24
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Statistics
Views
1990 since deposited on 2021-10-20
Acq. date: 2026-02-24
Citations