Browsing by author "Siau, S."
Now showing items 1-6 of 6
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Adhesion strength of the epoxy polymer/copper interface for use in microelectronics
Siau, S.; Vervaet, A.; Van Vaeck, L.; Schacht, E.; Demeter, U.; Van Calster, Andre (2005) -
Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper
Siau, S.; Vervaet, A.; Schacht, E.; Callewaert, K.; Van Calster, Andre; Degrande, S. (2005) -
Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes
Siau, S.; Vervaet, A.; Degrande, S.; Schacht, E; Van Calster, Andre (2005) -
Interface evolution of epoxy layers due to wet-chemical treatments and its relevance to adhesion of electrochemically deposited copper
Siau, S.; Vervaet, A.; Schacht, E.; Van Calster, Andre (2005-05) -
Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards
Siau, S.; De Baets, Johan; Van Calster, Andre; Heremans, L.; Tanghe, S. (2004) -
The development of epoxy polymer surface roughness due to wet chemical treatments and its relevance to adhesion of electrochemically deposited copper
Siau, S.; Vervaet, A.; Van Calster, Andre; Baert, D. (2005-06)