Browsing by author "Podpod, Arnita"
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Ultra-low warpage epoxy mold compound for fan-out wafer level package applications
Duval, Fabrice; Podpod, Arnita; Salahouelhadj, Abdellah; Phommahaxay, Alain; Bertheau, Julien; Rebibis, Kenneth June; Sleeckx, Erik; Beyne, Eric (2018)