Authors

Duval, Fabrice; Podpod, Arnita; Salahouelhadj, Abdellah; Phommahaxay, Alain; Bertheau, Julien; Rebibis, Kenneth June; Sleeckx, Erik; Beyne, Eric

Conference

6th Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum - MiNaPAD Forum

Title

Ultra-low warpage epoxy mold compound for fan-out wafer level package applications

Publication type

Proceedings paper