Publication:

Ultra-low warpage epoxy mold compound for fan-out wafer level package applications

Date

2018
Proceedings Paper
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dc.contributor.authorDuval, Fabrice
dc.contributor.authorPodpod, Arnita
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBertheau, Julien
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorSleeckx, Erik
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBertheau, Julien
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-25T18:23:16Z
dc.date.available2021-10-25T18:23:16Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30661
dc.identifier.urlhttps://www.minalogic.com/sites/default/files/flyer_minapad_2018.pdf
dc.source.conference6th Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum - MiNaPAD Forum
dc.source.conferencedate16/05/2018
dc.source.conferencelocationGrenoble France
dc.title

Ultra-low warpage epoxy mold compound for fan-out wafer level package applications

dc.typeProceedings paper
dspace.entity.typePublication
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