Browsing by author "Coello-Vera, A."
Now showing items 1-3 of 3
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Residual thermo-mechanical stresses in thinned-chip assemblies
Leseduarte, S.; Marco, S.; Beyne, Eric; Van Hoof, Rita; Marty, A.; Pinel, S.; Vendier, O.; Coello-Vera, A. (1999) -
Residual thermomechanical stresses in thinned-chip assemblies
Leseduarte, S.; Marco, S.; Beyne, Eric; Van Hoof, Rita; Marty, A.; Pinel, S.; Vendier, O.; Coello-Vera, A. (2000) -
UTCS: ultra thin chip stacking a WSI emulation technology
Coello-Vera, A.; Vendier, O.; Beyne, Eric; Van Hoof, Rita; Pinel,; Bailbé, J.P. (2000)