Authors

Leseduarte, S.; Marco, S.; Beyne, Eric; Van Hoof, Rita; Marty, A.; Pinel, S.; Vendier, O.; Coello-Vera, A.

Conference

Proceedings of 5th International Workshop on Thermal Investigations of ICs and Microstructures - THERMINIC

Title

Residual thermo-mechanical stresses in thinned-chip assemblies

Publication type

Proceedings paper

Embargo date

9999-12-31