Browsing by author "Wallace, Daniel"

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300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications

Jourdain, Anne; Buisson, Thibault; Phommahaxay, Alain; Privett, Marc; Wallace, Daniel; Sood, Sumant; Bisson, Peter; Beyne, Eric; Travaly, Youssef; Swinnen, Bart (2010-11)