Browsing by author "Wiesler, Ingo"
Now showing items 1-1 of 1
-
GHz-Scanning Acoustic Microscopy combined with TOFSIMS/AFM for wafer-level failure analysis of bonding interfaces
De Wolf, Ingrid; Khaled, Ahmad; Franquet, Alexis; Spampinato, Valentina; Conard, Thierry; Brand, Sebastian; Kögel, Michael; Wiesler, Ingo (2019)