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GHz-Scanning Acoustic Microscopy combined with TOFSIMS/AFM for wafer-level failure analysis of bonding interfaces
Publication:
GHz-Scanning Acoustic Microscopy combined with TOFSIMS/AFM for wafer-level failure analysis of bonding interfaces
Date
2019
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
De Wolf, Ingrid
;
Khaled, Ahmad
;
Franquet, Alexis
;
Spampinato, Valentina
;
Conard, Thierry
;
Brand, Sebastian
;
Kögel, Michael
;
Wiesler, Ingo
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2008
since deposited on 2021-10-27
1
last week
Acq. date: 2025-10-28
Citations
Metrics
Views
2008
since deposited on 2021-10-27
1
last week
Acq. date: 2025-10-28
Citations