Publication:

GHz-Scanning Acoustic Microscopy combined with TOFSIMS/AFM for wafer-level failure analysis of bonding interfaces

Date

2019
Proceedings Paper
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dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorKhaled, Ahmad
dc.contributor.authorFranquet, Alexis
dc.contributor.authorSpampinato, Valentina
dc.contributor.authorConard, Thierry
dc.contributor.authorBrand, Sebastian
dc.contributor.authorKögel, Michael
dc.contributor.authorWiesler, Ingo
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorKhaled, Ahmad
dc.contributor.imecauthorFranquet, Alexis
dc.contributor.imecauthorSpampinato, Valentina
dc.contributor.imecauthorConard, Thierry
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecKhaled, Ahmad::0000-0003-2892-3176
dc.contributor.orcidimecFranquet, Alexis::0000-0002-7371-8852
dc.contributor.orcidimecSpampinato, Valentina::0000-0003-3225-6740
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.date.accessioned2021-10-27T08:36:32Z
dc.date.available2021-10-27T08:36:32Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32846
dc.source.conference45th International Symposium for Testing and Failure Analysis (ISTFA)
dc.source.conferencedate10/11/2019
dc.source.conferencelocationPortland, OR USA
dc.title

GHz-Scanning Acoustic Microscopy combined with TOFSIMS/AFM for wafer-level failure analysis of bonding interfaces

dc.typeProceedings paper
dspace.entity.typePublication
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