Browsing by author "Tunca Altintas, Bensu"

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Cu Pad Surface Height Evaluation Technique by In-line SEM for Wafer Hybrid Bonding

Kasai, Hiroaki; Osaki, Mayuka; Hasumi, Kazuhisa; Mise, Nobuyuki; Tanaka, Maki; Tunca Altintas, Bensu; Chew, Soon Aik; Bogdanowicz, Janusz; Moussa, Alain; Saib, Mohamed; Zhang, Boyao; Charley, Anne-Laure (2024)
Detection of bonding voids for 3D integration

Chen, Cong; Van den Heuvel, Dieter; Beggiato, Matteo; Tunca Altintas, Bensu; Moussa, Alain; Vandooren, Anne; Baudemprez, Bart; Schobitz, Michael; Khaldi, Wassim; Bogdanowicz, Janusz; Beral, Christophe; Charley, Anne-Laure (2023)