Publication:

Detection of bonding voids for 3D integration

Date

2023
Proceedings Paper
https://doi.org/10.1117/12.2657950
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Author(s)

Chen, Cong  
;
Van den Heuvel, Dieter
;
Beggiato, Matteo  
;
Tunca Altintas, Bensu  
;
Moussa, Alain  
;
Vandooren, Anne  
;
Baudemprez, Bart  
;
Schobitz, Michael
;
Khaldi, Wassim
;
Bogdanowicz, Janusz  
;
Beral, Christophe  
;
Charley, Anne-Laure  

Journal

Proceedings of SPIE

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1603 since deposited on 2024-04-17
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