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Detection of bonding voids for 3D integration
Publication:
Detection of bonding voids for 3D integration
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Date
2023
Proceedings Paper
https://doi.org/10.1117/12.2657950
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Chen, Cong
;
Van den Heuvel, Dieter
;
Beggiato, Matteo
;
Tunca Altintas, Bensu
;
Moussa, Alain
;
Vandooren, Anne
;
Baudemprez, Bart
;
Schobitz, Michael
;
Khaldi, Wassim
;
Bogdanowicz, Janusz
;
Beral, Christophe
;
Charley, Anne-Laure
Journal
Proceedings of SPIE
Abstract
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Downloads
587
since deposited on 2024-04-17
94
last month
27
last week
Acq. date: 2026-01-09
Views
947
since deposited on 2024-04-17
3
last month
1
last week
Acq. date: 2026-01-09
Citations