Browsing by author "Eichhammer, Y."
Now showing items 1-2 of 2
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3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI
Sirbu, B.; Eichhammer, Y.; Oppermann, H.; Tekin, T.; Kraft, J.; Sidorov, V.; Yin, Xin; Bauwelinck, Johan; Neumeyr, C.; Soares, F. (2019) -
5G mm wave networks leveraging enhanced fiber-wireless convergence for high-density environments: The 5G-PHOS approach
Papaioannou, S.; Kalfas, G.; Vagionas, C.; Maniotis, P.; Miliou, A.; Pleros, N.; Anet Neto, L.; Chanclou, P.; Haj-Ali, M.; Bakopoulos, P.; Caillaud, C.; Debregas, H.; Sirbu, M.B.; Eichhammer, Y.; Theodoropoulos, E.; Lyberopoulos, G.; Kartsakli, E.; Vardakas, J.; Torfs, Guy; Yin, Xin; Tsagkaris, K.; Demestichas, P.; Giannoulis, G.; Avramopoulos, H.; Lentaris, G.; Varvarigos, E.; Tafur Monroy, I.; Dayan, E.; Leiba, Y.; Dimogiannis, I.; Kontogiannis, A.; Magri, R.; Tartaglia, A.; Roeloffzen, CGH.; Oldenbeuving, RM. (2018)