Browsing by author "Sudbury-Holtschlag, J."
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Introducing a silicone under the bump configuration for stress relief in a wafer level package
Vanden Bulcke, Mathieu; Gonzalez, Mario; Vandevelde, Bart; Winters, Christophe; Beyne, Eric; Larson, L.; Harkness, B.R.; Gardner, G.; Mohamed, M.; Sudbury-Holtschlag, J.; Meynen, H. (2003)