Now showing items 1-2 of 2

    • Advanced physical analysis of 3D interconnect 

      Ramachandran, Vidhya; Torregiani, Cristina; Dong Wook, Kim; Gu, Sam; Nowak, Matt; DiBattista, Michael; Babak, Motamedi; Civale, Yann; Redolfi, Augusto; Beyne, Eric; Croes, Kristof; Li, Yunlong; Routh, Bryan; Rue, Chad (2012)
    • Impact of thinning and packaging on a deep sub-micron CMOS product 

      Perry, Dan; Ray, Urmi; Gu, Sam; Nakamoto, Mark; Sy, Wing; Wang, Kevin; Ruythooren, Wouter; Yang, Yu; De Wolf, Ingrid; Cotrin Teixeira, Ricardo; Gonzalez, Mario; Simons, Veerle; Berry, Christopher J.; Lee, KiWook; Burggraf, Jürgen; Pargfrieder, Stefan (2009)