Publication:

Impact of thinning and packaging on a deep sub-micron CMOS product

Date

2009
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Author(s)

Perry, Dan
;
Ray, Urmi
;
Gu, Sam
;
Nakamoto, Mark
;
Sy, Wing
;
Wang, Kevin
;
Ruythooren, Wouter  
;
Yang, Yu
;
De Wolf, Ingrid  
;
Cotrin Teixeira, Ricardo
;
Gonzalez, Mario  
;
Simons, Veerle  
;
Berry, Christopher J.
;
Lee, KiWook
;
Burggraf, Jürgen
;
Pargfrieder, Stefan

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2059 since deposited on 2021-10-18
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