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Impact of thinning and packaging on a deep sub-micron CMOS product
Publication:
Impact of thinning and packaging on a deep sub-micron CMOS product
Date
2009
Presentation
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Perry, Dan
;
Ray, Urmi
;
Gu, Sam
;
Nakamoto, Mark
;
Sy, Wing
;
Wang, Kevin
;
Ruythooren, Wouter
;
Yang, Yu
;
De Wolf, Ingrid
;
Cotrin Teixeira, Ricardo
;
Gonzalez, Mario
;
Simons, Veerle
;
Berry, Christopher J.
;
Lee, KiWook
;
Burggraf, Jürgen
;
Pargfrieder, Stefan
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2049
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations
Metrics
Views
2049
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations