Publication:

Impact of thinning and packaging on a deep sub-micron CMOS product

Date

2009
Presentation
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dc.contributor.authorPerry, Dan
dc.contributor.authorRay, Urmi
dc.contributor.authorGu, Sam
dc.contributor.authorNakamoto, Mark
dc.contributor.authorSy, Wing
dc.contributor.authorWang, Kevin
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorYang, Yu
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorCotrin Teixeira, Ricardo
dc.contributor.authorGonzalez, Mario
dc.contributor.authorSimons, Veerle
dc.contributor.authorBerry, Christopher J.
dc.contributor.authorLee, KiWook
dc.contributor.authorBurggraf, Jürgen
dc.contributor.authorPargfrieder, Stefan
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorSimons, Veerle
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecSimons, Veerle::0000-0001-5714-955X
dc.date.accessioned2021-10-18T01:39:25Z
dc.date.available2021-10-18T01:39:25Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16009
dc.source.conferenceDesign, Automation & Test in Europe Conference -DATE : Workshop on 3D Integration (W5)
dc.source.conferencedate20/04/2009
dc.source.conferencelocationNice France
dc.title

Impact of thinning and packaging on a deep sub-micron CMOS product

dc.typeOral presentation
dspace.entity.typePublication
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