Browsing by author "Cosemans, P."

Dynamics of electromigration induced void-hillock growth and precipitation/dissolution of addition elements studied by in-situ electron microscopy resistance measurements

D'Haen, Jan; Cosemans, P.; Manca, Jean; Lekens, Geert; Martens, T.; De Ceuninck, Ward; D'Olieslaeger, Marc; De Schepper, Luc; Maex, Karen (1999)

Electromigration-induced drift in damascene and plasma-etched Al(Cu). I: Kinetics of Cu depletion in polycrystalline interconnects

Proost, Joris; Witvrouw, Ann; Maex, Karen; D'Haen, Jan; Cosemans, P. (2000)

Stress relaxation in Al(Cu) thin films

Proost, Joris; Witvrouw, Ann; Cosemans, P.; Roussel, Philippe; Maex, Karen (1997)

Stress relaxation in Al-Cu and Al-Si-Cu thin films

Witvrouw, Ann; Proost, Joris; Roussel, Philippe; Cosemans, P.; Maex, Karen (1999)

Study of Cu diffusion in an Al-1%Si-0.5%Cu bond pad with an Al-1%Si bond wire attached using scanning electron microscopy

Cosemans, P.; D'Haen, Jan; Witvrouw, Ann; Proost, Joris; D'Olieslaeger, Marc; De Ceuninck, Ward; Maex, Karen; De Schepper, Luc (1998)

Thin nanocrystalline CVD diamond films based on nanodiamond / TiO2 sol-gel composites

Haenen, Ken; Daenen, M.; Zhang, L.; Janssens, S.D.; Cosemans, P.; Hardy, An; Verbeeck, J.; Van Bael, Marlies; Nesladek, Milos; Van Tendeloo, G. (2009)