Browsing by author "Karmarkar, A.P."

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Modeling copper plastic deformation and liner viscoelastic flow effects on performance and reliability in Through Silicon Via (TSV) fabrication processes

Karmarkar, A.P.; Xu, X.; El Sayed, K.; Guo, Wei; Van der Plas, Geert; Van Huylenbroeck, Stefaan; Gonzalez, Mario; Absil, Philippe; Beyne, Eric (2019)