Authors

Karmarkar, A.P.; Xu, X.; El Sayed, K.; Guo, Wei; Van der Plas, Geert; Van Huylenbroeck, Stefaan; Gonzalez, Mario; Absil, Philippe; Beyne, Eric

ISSN

1530-4388

Issue

4

Journal

IEEE Transactions on Device and Materials Reliability

Volume

19

Title

Modeling copper plastic deformation and liner viscoelastic flow effects on performance and reliability in Through Silicon Via (TSV) fabrication processes

Publication type

Journal article