Publication:
Modeling copper plastic deformation and liner viscoelastic flow effects on performance and reliability in Through Silicon Via (TSV) fabrication processes
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1957 since deposited on 2021-10-27
1last month
Acq. date: 2026-02-27
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Statistics
Views
1957 since deposited on 2021-10-27
1last month
Acq. date: 2026-02-27
Citations