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Modeling copper plastic deformation and liner viscoelastic flow effects on performance and reliability in Through Silicon Via (TSV) fabrication processes
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1956 since deposited on 2021-10-27
1last month
Acq. date: 2025-12-15
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Metrics
Views
1956 since deposited on 2021-10-27
1last month
Acq. date: 2025-12-15
Citations