Publication:

Modeling copper plastic deformation and liner viscoelastic flow effects on performance and reliability in Through Silicon Via (TSV) fabrication processes

Date

2019
Journal article
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dc.contributor.authorKarmarkar, A.P.
dc.contributor.authorXu, X.
dc.contributor.authorEl Sayed, K.
dc.contributor.authorGuo, Wei
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorGonzalez, Mario
dc.contributor.authorAbsil, Philippe
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorGuo, Wei
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorAbsil, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-27T11:10:33Z
dc.date.available2021-10-27T11:10:33Z
dc.date.issued2019
dc.identifier.issn1530-4388
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33254
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8832265
dc.source.beginpage642
dc.source.endpage653
dc.source.issue4
dc.source.journalIEEE Transactions on Device and Materials Reliability
dc.source.volume19
dc.title

Modeling copper plastic deformation and liner viscoelastic flow effects on performance and reliability in Through Silicon Via (TSV) fabrication processes

dc.typeJournal article
dspace.entity.typePublication
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