Browsing by author "Neidrich, Jason"

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Integration and manufacturing aspects of moving from HT-10.10 to ZoneBOND™ in temporary wafer bonding and debonding for 3D applications

Jourdain, Anne; Phommahaxay, Alain; Verbinnen, Greet; Murdoch, Gayle; Miller, Andy; Rebibis, Kenneth June; Guerrero, Alice; McCutcheon, Jeremy; Privett, Mark; Neidrich, Jason; Beyer, Gerald; Beyne, Eric (2013)