Authors

Jourdain, Anne; Phommahaxay, Alain; Verbinnen, Greet; Murdoch, Gayle; Miller, Andy; Rebibis, Kenneth June; Guerrero, Alice; McCutcheon, Jeremy; Privett, Mark; Neidrich, Jason; Beyer, Gerald; Beyne, Eric

Conference

IEEE 63rd Electronic Components and Technology Conference - ECTC

Title

Integration and manufacturing aspects of moving from HT-10.10 to ZoneBOND™ in temporary wafer bonding and debonding for 3D applications

Publication type

Proceedings paper

Embargo date

9999-12-31