Browsing by author "Funaya, Takuo"
Now showing items 1-5 of 5
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Alternative patterning techniques enabling fine pitch interconnection on topography surfaces
Iker, Francois; Funaya, Takuo; Jamieson, Geraldine; Beyne, Eric (2010) -
Diamond bit cutting as alternative to polymer patterning for 3D interconnections technologies
Iker, Francois; Funaya, Takuo; Cotrin Teixeira, Ricardo; Ruythooren, Wouter (2009) -
High density 3D die stacking without through-Si-vias: ultra thin chip embedding as enabling technology
Beyne, Eric; Iker, Francois; Soussan, Philippe; Funaya, Takuo; Vanfleteren, Jan; Cotrin Teixeira, Ricardo; Torfs, Tom; Christiaens, Wim (2008) -
Ultra thin chip embedding technology (UTCS-UTCP)
Beyne, Eric; Christiaens, Wim; Torfs, Tom; Huwel, W.; Perdu, Wim; Vanfleteren, Jan; Iker, Francois; Funaya, Takuo; Buisson, Thibault; De Preter, Inge; Jamieson, Geraldine; Soussan, Philippe; Van Hoof, Chris (2010) -
Ultra thin die embedding technology with 20um-pitch interconnection
Funaya, Takuo; Buisson, Thibault; De Preter, Inge; Beyne, Eric; Iker, Francois (2010)