Ultra thin chip embedding technology (UTCS-UTCP)

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Authors
Beyne, Eric; Christiaens, Wim; Torfs, Tom; Huwel, W.; Perdu, Wim; Vanfleteren, Jan; Iker, Francois; Funaya, Takuo; Buisson, Thibault; De Preter, Inge; Jamieson, Geraldine; Soussan, Philippe; Van Hoof, Chris
Conference
Embedded Wafer level Packaging Workshop, IMAPS-France
Title
Ultra thin chip embedding technology (UTCS-UTCP)
Publication type
Oral presentation
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