Publication:

Ultra thin chip embedding technology (UTCS-UTCP)

Date

2010
Presentation
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dc.contributor.authorBeyne, Eric
dc.contributor.authorChristiaens, Wim
dc.contributor.authorTorfs, Tom
dc.contributor.authorHuwel, W.
dc.contributor.authorPerdu, Wim
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorIker, Francois
dc.contributor.authorFunaya, Takuo
dc.contributor.authorBuisson, Thibault
dc.contributor.authorDe Preter, Inge
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorSoussan, Philippe
dc.contributor.authorVan Hoof, Chris
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorTorfs, Tom
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecTorfs, Tom::0000-0002-1302-3346
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.date.accessioned2021-10-18T15:21:16Z
dc.date.available2021-10-18T15:21:16Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16748
dc.source.conferenceEmbedded Wafer level Packaging Workshop, IMAPS-France
dc.source.conferencedate24/06/2010
dc.source.conferencelocationGernoble France
dc.title

Ultra thin chip embedding technology (UTCS-UTCP)

dc.typeOral presentation
dspace.entity.typePublication
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