Publication:
High density 3D die stacking without through-Si-vias: ultra thin chip embedding as enabling technology
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1929 since deposited on 2021-10-17
2last month
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Acq. date: 2026-01-10
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Views
1929 since deposited on 2021-10-17
2last month
2last week
Acq. date: 2026-01-10
Citations