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High density 3D die stacking without through-Si-vias: ultra thin chip embedding as enabling technology
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Authors
Beyne, Eric
;
Iker, Francois
;
Soussan, Philippe
;
Funaya, Takuo
;
Vanfleteren, Jan
;
Cotrin Teixeira, Ricardo
;
Torfs, Tom
;
Christiaens, Wim
Conference
SEMICON Europe: Advanced Packaging Conference
Title
High density 3D die stacking without through-Si-vias: ultra thin chip embedding as enabling technology
Publication type
Proceedings paper
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