Publication:
High density 3D die stacking without through-Si-vias: ultra thin chip embedding as enabling technology
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1930 since deposited on 2021-10-17
3last month
Acq. date: 2026-01-25
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Statistics
Views
1930 since deposited on 2021-10-17
3last month
Acq. date: 2026-01-25
Citations