Publication:
High density 3D die stacking without through-Si-vias: ultra thin chip embedding as enabling technology
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1927 since deposited on 2021-10-17
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Acq. date: 2025-10-25
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Views
1927 since deposited on 2021-10-17
426item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations